技术参数

• Package / Case 225-BBGA
• Mounting Type Surface Mount
• Interface Host Interface, Link Port, Serial Port
• Type Floating Point
• Operating Temperature 0°C ~ 85°C (TC)
• Non-Volatile Memory External
• On-Chip RAM 512kB
• Voltage - I/O 3.30V
• Voltage - Core 3.30V
• Clock Rate 40MHz
• Supplier Device Package 225-PBGA (23x23)
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)