技术参数

• Package / Case 64-TFBGA
• Mounting Type Surface Mount
• Interface I2C, UART, SPI, PDM, I2S, 12-bit ADC
• Operating Temperature -20°C ~ 85°C (TJ)
• Voltage - Supply 1.1V
• Program SRAM Bytes 512K
• Core Type 32-Bit ARM M4F
• Data SRAM Bytes 512K
• FPGA Gates 2k
• FPGA Core Cells 891
• FPGA SRAM 64kb
• FPGA Registers 891
• Supplier Device Package 64-BGA (3.5mm x 3.5mm)
• Speed 80 MHz
• ECCN 3A991
• HTSUS 8542.39.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant